Wafer Pinhole inspection equipment

advantages introduction

Mass production defect detection equipment recognized by international and domestic clients

Throughput reaches 144WPH
Automatic Defect Review (ADR) and Automatic Defect Classification (ADC)
Self developed defect detection algorithm combined with deep learning, automatic defect detection (AOI) and automatic defect classification (ADC)
Internal and surface wafer defect detection can be performed simultaneously

Parameter configuration

Adopting an infrared camera scanning penetration system
Independently designed special infrared light source and infrared camera improve the capture rate of internal defects in wafers
Equipped with high-definition re inspection camera for precise defect detection
Paired with dual or multiple port EFEM units to dock with OHT&AMR for fully automatic loading and unloading

Function Description

Applicable products: 12 inch semiconductor wafers
Applicable process segments: chamfering/surface grinding/surface polishing/cleaning/drying/PW final inspection/Epi, SOI, etc
Function Description:
1. The EFEM unit supports manual or OHT feeding of FOSB/FOUP/OC and other  materials
2. Defect detection of pores inside and on the  surface of crystal grains
3. Independently developed defect detection algorithm that automatically detects, analyzes, and classifies defects
4. Defect types include: Crack, Pit, PinHole, etc