晶圆字符量测设备

优点介绍

第一代硅晶圆字符量测已得到国内客户认可，正在研发第二代SIC晶圆字符量测
国内首家实现晶圆字符在线测量设备
采用激光显微镜共焦点原理以及自研算法实现高精度量测
量测重复精度<1um
The first generation of SI wafer character measurement has been recognized by domestic customers, and the second generation of SIC wafer character measurement is currently under development
The first domestic device to achieve online measurement of wafer characters
Using the confocal principle of laser microscope and self-developed algorithm to achieve high-precision measurement
Equipment measurement repeatability accuracy<1um

参数配置

搭载自主光路设计+高清相机实现晶圆自动引导定位
采用高精度激光显微镜利用20X/50X物镜对字符自动扫描测量
搭载自主光路设计+高清相机实现晶圆膜边距量测
搭配双port或多port EFEM单元对接OHT&AMR实现全自动上下料
Equipped with independent optical path design and high-definition camera to achieve automatic wafer guidance and positioning
Using high-precision laser microscope and 20X/50X objective lens for automatic scanning and measurement of characters
Equipped with independent optical path design and high-definition camera to achieve measurement of wafer film edge distance
Paired with dual or multiple port EFEM units to dock with OHT&AMR for fully automatic loading and unloading

功能描述

适用产品：半导体用6/8/12寸硅晶圆/SIC晶圆
适用工艺段：表面研磨 / 表面抛光 / 清洗 / 终检等
功能说明：
1.EFEM单元支持FOSB/FOUP/OC人工或AGV自动上料
2.高清相机自动引导定位
3.高精度激光显微镜自动测量
4.高清相机实现晶圆膜边距量测
Applicable products: 6/8/12 inch semiconductor Si wafers, SIC wafer
Applicable process segments: Surface grinding/polishing/cleaning/final inspection, etc
Function Description:
1. The EFEM unit supports manual or OHT automatic feeding such as FOSB/FOUP/OC
2. HD camera automatically guides positioning
3. High precision laser microscope automatic measurement
4. High definition camera for measuring wafer film edge distance