晶圆隐裂检测设备

优点介绍

自研缺陷检测算法+深度学习结合，缺陷自动分类
利用红外技术对晶圆片内部检测，最小检测隐裂缺陷0.4mm
有效控制内部隐裂缺陷片在后制程流动
高速检测自然或人为的隐裂
硬件和软件配备符合SEMI标准的标准接口，快速可靠进行整合
Self developed defect detection algorithm combined with deep learning for automatic defect classification
Using infrared technology for internal inspection of wafer, the minimum detectable hidden crack defect is 0.4mm
Effectively control the flow of internal hidden crack defects in the subsequent process
High speed detection of natural or man-made hidden cracks
Hardware and software are equipped with standard interfaces that comply with SEMI standards for fast and reliable integration

参数配置

搭载自研的红外光照系统+高速线性短波红外相机实现晶圆内部隐裂缺陷检测
具备检测、分类功能，综合调整阈值和裂纹特征、灵活优化检测结果
搭配4port或多port EFEM单元对接OHT&AMR实现全自动上下料
Equipped with self-developed infrared illumination system and high-speed linear shortwave infrared camera to achieve detection of hidden cracks and defects inside wafers
Capable of detecting and classifying, comprehensively adjusting thresholds and crack characteristics, and flexibly optimizing detection results
Paired with 4-port or multi port EFEM units to dock with OHT&AMR for fully automatic loading and unloading

功能描述

适用产品：半导体用6/8/12寸晶圆
适用工艺段： 线割后工艺 / 抛光前工艺 
功能说明：
1.EFEM单元支持FOSB/FOUP/OC等人工或OHT、AGV自动上料
2.缺陷类型包括：检测晶圆内部人眼无法观测到的裂纹(隐裂)等
Applicable products: 6/8/12 inch wafers for semiconductors
Applicable process segment: post cutting process/pre polishing process
Function Description:
1. The EFEM unit supports manual or OHT, AGV automatic loading of FOSB/FOUP/OC and other materials
2. Defect types include: detecting cracks (hidden cracks) inside the wafer that cannot be observed by the human eye