硅片边缘/表背面复合检测设备 AXM-1200HT
优点介绍
得到国际&国内客户端认可的量产型缺陷检测设备
检测精度为0.2μm的情况下，Throughput达到80WPH
Pit检测单元自动缺陷Review(ADR)和自动缺陷分类（ADC）
自研缺陷检测算法+深度学习结合，自动缺陷检测(AOI)和自动缺陷分类（ADC）
标准化检测单元，多模块组合，支持定制化结合
自研晶圆边缘夹持定位检测，减少对晶圆片二次污染和损伤
Mass production defect detection equipment recognized by international and domestic clients
With a detection accuracy of 0.2 μ m, the production capacity is higher and the throughput reaches 80WPH
Pit detection unit automatic defect review (ADR) and automatic defect classification (ADC)
Combining self-developed defect detection algorithm with deep learning, automatic defect detection (AOI) and automatic defect classification (ADC)
Standardized detection unit, multi module combination, supporting customized combination
Self developed wafer edge clamping and positioning detection to reduce secondary pollution and damage to the wafer
参数配置
搭载自有专利的激光检测器+5台高速线性相机实现晶圆的边缘检测搭载自研光学架构和光学系统实现正背面缺陷检测
搭载自研光学架构实现Pit缺陷精准检测
搭配双port或多port EFEM单元对接OHT&AMR实现全自动上下料
Equipped with a patented laser detector and 5 high-speed linear cameras to achieve edge detection of wafers
Equipped with self-developed optical architecture and optical system to achieve front and back defect detection
Equipped with self-developed optical architecture to achieve precise detection of Pit defects
Paired with dual or multi port EFEM units to connect OHT&AMR for fully automatic loading and unloading
功能描述
适用产品：半导体用8/12寸晶圆适用工艺段：倒角 / 表面研磨 / 表面抛光 / 清洗 / 干燥 / PW终检 / Epi 、SOI等
功能说明：
1.EFEM单元支持FOSB/FOUP/OC等人工或OHT上料
2.晶圆的边缘+正背面+Pit缺陷检测
3.自主研发的缺陷检测算法，对缺陷自动检测，分析，并进行缺陷分类
4.缺陷类型包括：Scratch、Particle、Cloud、Grind Mark、Dirty、Haze、Pin mark、Halo、 Crack、Chip 、Pit等等
Applicable products: 8/12 inch wafers for semiconductors
Applicable process segments: chamfering/surface grinding/surface polishing/cleaning/drying/PW final inspection/Epi, SOI, etc
Function Description:
1. The EFEM unit supports manual or OHT loading such as FOSB/FOUP/OC
2. Edge+front and back+Pit defect detection of wafers
3. Independently developed defect detection algorithms that automatically detect, analyze, and classify defects
4. Defect types include: Scratch, Particle, Cloud, Grind Mark(SG), Dirty, Haze, Pin mark, Halo, Crack, Chip, Pit, etc
