Automatic Solid Crystal Assembly Welding Equipment: CD-CDPCO

advantages introduction

Parameter configuration

Applicable products: SMA/B/C, SOD123, MBF, ABS, bridge series, TO/ITO series, Q/DF， Photovoltaic module series, etc.
Machine Introduction: This model provides integrated operations such as frame screen printing, chip placement, glue dispensing, CLIP picking and placing, and welding for assembly processes.
UPH: 30K-80K/hr (speed may vary slightly due to differences in framework layout and chip size)
Frame feeding method: Stacking feeding
Grain loading mode: Blue film chip picking and placing
Jumper feeding mode: Bulk jumper or roll jumper
Product receiving method: magazine receiving

Function Description

Configure CCD visual inspection system, 100% full inspection of solder paste volume.
Four station swing arm blue film crystal taking, high-efficiency and high-precision, CCD positioning for inspection and release.
Automatic multi roll loading and unloading area, with good operability and high safety for partition placement and retrieval.