Automatic assembly welding equipment: CD-MTPPO
advantages introduction
Parameter configuration
Applicable products: Welding SMA, SMB, SMC, SOD-123, MBF, ABS, SMT resistors, capacitors and other two-piece bulk chip architecture products.Machine Introduction: This model provides integrated operations such as AB frame screen printing, chip placement, lamination, sintering, etc. for automatic assembly of two-piece frame products.
UPH: 40-90K/hr (speed may vary slightly due to differences in framework layout and chip size)
Frame feeding method: Stacking feeding
Grain feeding mode: Bulk chip rocking disc feeding
Product receiving method: magazine receiving
Function Description
Configure CCD visual inspection system, 100% full inspection of solder paste volume.Equipped with a graphite boat circulation system, reducing manpower and materials.
Automatic material receiving function, four full and four empty material box clip, full material/abnormal alarm function.
