Glass wafer laser drilling equipment: SFD3000
advantages introduction
Equipped with laser power automatic compensation function
Can be used for glass wafer drilling and glass cutting
Equipped with Bessel optics(axicon) for constant peak power along an increased depth of focus(DOF) region, ranging typically from 0.5~2.0mm
Equipped with automatic scanner calibration and automatic offset compensation
General spot size is about 2~3um
Parameter configuration
Function Description
Applicable products: 8-inch, 12 inch glass wafersMain function: To achieve laser drilling / cutting on glass wafer
Import and export method: FOUP to FOUP
Size:L1500 * W2000 * H1800mm
