LED stealth dicing equipment：SLS602
advantages introduction
Two beams/pass processing equipped with beam gap auto adjustment to maximize WPH
Fully automatic broken wafer processing include edge detection / vision align / auto dicing.
Equipped with height sensor to measure/compensate wafer flatness to achieve 3um accuracy.
Different recipe setting in single cassettes
Different dicing parameter for CH1/CH2
Parameter configuration
Function Description
Applicable products: 4-inch, 6-inch, LED sapphire wafer / SiC waferMain function: to achieve modified layer in the sapphire wafer by focusing a laser inside the wafer，not affect the surface of the wafer
Import and export method: Ring Frame
Size: L1560 * W1600 * H1800mm
