Wafer formed ultra precision laser grooving equipment: LWS3000W
advantages introduction
Wafer formed laser grooving for 3D package & factory automation
Utilizing high-frequency picosecond lasers to reduce thermal effects and thermal accumulation during grooving
Implementing high-speed and precision micro machining using an air flotation platform
Beam shaping reduces energy loss
Narrow and wide beam can be automatically switched
Realize high-quality processing
Improving productivity through three spot processing methods
Parameter configuration
Function Description
Applicable products: 8-inch and 12-inch wafers for semiconductorsMain function: Use picosecond laser to remove passivation layer,
TEG, metal wiring, and Low-K materials
Import and export method: Ring Frame
Size: L2200 * W2000 * H1850mm
