Wafer top side laser marking equipment: SSTM3000
advantages introduction
Equipped with laser power automatic compensation function
Can be used for wafer ID marking / reference die marking / rejected die marking.
Equipped with metal cassettes / pick & place / align vision / OCR reader / marking head , for laser marking and real-time monitoring of marking positions and wafer marking recognition.
Equipped with automatic scanner calibration , automatic offset compensation, and iron ring wafer center compensation functions
Automatic switching of marking mode for wafer ID / rejected die / reference die marking
Parameter configuration
Function Description
Applicable products: 8-inch, 12 inch wafers mounted on ring frame carrier.Main function: To achieve laser marking for wafer ID/rejected die/
reference die on the wafer front side
Import and export method: Metal Cassettes,Ring Frame wafer
Size: L2200 * W2000 * H1850mm
