Wafer Ultra precision laser grooving equipment: LWS3000
advantages introduction
Utilizing high-frequency picosecond lasers to reduce thermal effects and thermal accumulation during grooving
Implementing high-speed and precision micro machining using an air flotation platform
Beam shaping reduces energy loss
Narrow and wide beam can be automatically switched
Realize high-quality processing
Improving productivity through three spot processing methods
Parameter configuration
Function Description
Applicable products: 8-inch and 12 inch wafers for semiconductorsMain function : Use picosecond laser to remove passivation layer, TEG, metal wiring, and Low-K materials
Import and export method: Ring Frame
Size: L2200 * W2000 * H1850mm
