Wafer Flatness Equipment
advantages introduction
The measurement data and data analysis results have been recognized by the client
Develop online and offline measuring equipment
Using the principle of optical interference and self-developed algorithms to achieve high-precision measurement
Support multiple paths or custom point selection measurement functions
Measurement repeatability accuracy<0.1um
Parameter configuration
Equipped with self-developed calibration unit to achieve automatic wafer guidance and positioningAdopting a high-precision motion platform to ensure fast and stable movement, as well as quick positioning
Equipped with an optical interference detection module for rapid measurement
Paired with dual or multiple port EFEM units to dock with OHT&AMR for fully automatic loading and unloading
Function Description
Applicable products: 6/8/12 inch silicon wafers for semiconductorsApplicable process segments: wire cutting/surface grinding/surface polishing/cleaning/final inspection, etc
Function Description:
1. EFEM unit supports FOSB/FOUP/OC manual or AGV automatic feeding
2. Calibration unit automatically guides positioning
3. High precision detection module for automatic measurement
