Wafer film thickness measuring equipment
advantages introduction
Paired with SE+SR measurement modes
Wide wavelength range, supporting 190nm~1100nm
Wide measurement range, 1nm-100 μ m
Multiple measurement layers, 1-10 layers
High repeatability accuracy, 0.03nm
Fast measurement speed,<1s/point
Parameter configuration
Equipped with SE ellipsometer and SR spectroscopic interferometer thickness gaugeCooperate with high-precision camera guidance for positioning and real-time observation
Paired with dual or multiple port EFEM units to dock with OHT&AMR ｆor fully automatic loading and unloading
Function Description
Applicable products: Semiconductor 8/12 inch patterned waferApplicable process segments: Thin film deposition, photoresist, laser slotting, wafer cutting, etc
Function Description:
1. The EFEM unit supports manual or OHT automatic feeding such as FOSB/FOUP/OC
2. High definition camera guided positioning
3. SE/SR mode switching, automatic measurement of film thickness and optical constants
