Wafer outline dimension measurement equipment
advantages introduction
The first generation of Si wafer contour measurement has been recognized by domestic customers, and the second generation of SIC wafer character measurement is currently under development
Using independently developed measurement modules and algorithms to achieve high-precision measurement and data analysis
Benchmarking with foreign equipment suppliers for higher data accuracy
Equipment measurement repeatability accuracy<1um
Parameter configuration
Equipped with independent optical path design and high precision micrometer to achieve automatic wafer guidance and positioningAdopting self-developed high-precision alignment calibration platform
Equipped with independent optical path design and high-definition camera to achieve wafer contour measurement
Integrated EFEM with smaller device size
Function Description
Applicable products: 6/8/12 inch semiconductor Si wafers, SIC waferApplicable process segments: Chamfering/edge polishing/surface grinding/surface polishing/cleaning/final inspection, etc
Function Description:
1. The EFEM unit supports manual or OHT automatic feeding such as FOSB/FOUP/OC
2. HD camera automatically guides positioning
3. High precision micrometer for measuring diameters and other dimensions
4. High definition camera for wafer contour measurement
