Wafer backside all-round monitoring equipment BMW-1200R

advantages introduction

A comprehensive edge monitoring device recognized by international and domestic clients
Combining self-developed defect detection algorithm with deep learning, automatic defect review (ADR) and automatic defect classification (ADC）
Online Review Inspection, output color images
Full directional inspection of back of the wafer, with a minimum detection defect of 0.2um
Back defect inspection, all 8 major processes can achieve all-round monitoring

Parameter configuration

Equipped with 3 high-definition cameras to achieve backside inspection of wafers
Equipped with self-developed optical architecture and optical system to achieve automatic defect detection
Equipped with scanning laser microscope to achieve defect 2D&3D information output
Equipped with multiple magnification objectives to achieve automatic magnification switching
Integrated EFEM with smaller device size
The device has passed SEMI certification

Function Description

Applicable products: 12 inch semiconductor wafers, W2W bonding wafers
Applicable process segments: DRAM Flash process/Flash process/AP process
Function Description:
1. The EFEM unit supports manual or OHT automatic feeding such as FOSB/FOUP/OC
2. Comprehensive monitoring of edge defect detection and size measurement of wafers
3. Defect types include Scratch, Crack, Chuck Mark, Chip, Pin Mark, Circle Defect, Particle, Halo, Cloud and Haze, EPI specific defects, etc
4. Measurement includes: 2D&3D morphology and size of defects