Wafer edge all-round monitoring device: RXW-1200

advantages introduction

A comprehensive edge monitoring device recognized by international and domestic clients

Combining self-developed defect detection algorithm with deep learning, automatic defect review (ADR) and automatic defect classification (ADC)
Online 220 degree Review Inspection, outputting color images
Omni directional detection of wafer edges, with a minimum detection defect of 0.2um
Simultaneously achieving edge defect detection, thickness measurement, and edge size measurement

Parameter configuration

Equipped with a patented laser detector and 5 high-speed linear cameras to achieve edge detection of wafers
Equipped with self-developed optical architecture and optical system for size measurement
Measurement and analysis of Edge Profile using collimated projection imaging technology
Integrated EFEM with smaller device size
The device has passed SEMI certification

Function Description

Applicable products: 12 inch wafers for semiconductors, W2W bonding wafer
Applicable process segments: CIS process/TSV process/HBM process
Function Description:
1. The EFEM unit supports manual or OHT automatic feeding such as FOSB/FOUP/OC
2. Comprehensive monitoring of edge defect detection and size measurement of wafers
3. Defect types include: Scratch Crack, Chip, Dirty, Bubble, Chipping, Gathering of small dots, Pit, Flake, Polymer Reside, Peel, etc
4. Measurement includes: wafer thickness Measurement of edge contour, cutting height, and width after bonding Is the Wafer aligned Notch alignment, etc