Silicon wafer edge/back surface detection equipment: AXM-1200FPXL-N

advantages introduction

Mass production defect detection equipment recognized by international and domestic clients

Full directional inspection of the edge and front and back of the wafer, with a minimum detection defect of 0.2um
Unique Notch detection module, achieving Notch global detection
Self developed defect detection algorithm, automatic defect detection (AOI) and automatic defect classification (ADC)
Standardized detection unit, multi module combination, supporting customized combination
Self developed wafer edge clamping and positioning detection to reduce secondary pollution and damage to the wafer

Parameter configuration

Equipped with a patented laser detector and 5 high-speed linear cameras to achieve edge detection of wafers
Equipped with self-developed optical architecture and optical system to achieve front and back defect detection
Equipped with 4 high-performance cameras for full area monitoring of Notch department
The new feature (Auto.2D review) can be optional
Paired with dual or multi port EFEM units for OHT&AMR docking

Function Description

Applicable products: 12 inch wafers for semiconductors
Applicable process segments: chamfering/surface grinding/surface polishing/cleaning/drying/PW final inspection/Epi, SOI, etc
Function Description:
1. The EFEM unit supports manual or OHT loading such as FOSB/FOUP/OC
2. Comprehensive defect detection of the edge, front andback, and Notch parts of the wafer
3. Defect types include: Scratch, Particle, Cloud, Grind Mark (SG), Dirty, Haze, Pin mark, Halo, Crack, Chip, etc