Wafer back side laser marking equipment: LWM3000
advantages introduction
Equipped with laser power automatic compensation function
Can be used for elevation warping products, with a warping degree of ≤ 10mm
Equipped with image fusion function for upper and lower cameras, capable of real-time monitoring of marking positions, and with marking self inspection function
Equipped with automatic scanner calibration , automatic offset compensation, and iron ring wafer center compensation functions
Minimum marking character height is 0.1mm
Parameter configuration
Function Description
Applicable products: 8-inch, 12-inch mirror wafers, coated wafers, and 6-inch coated wafers (customizable according to customer requirements)Main function: To achieve laser marking of small characters on the back of wafer chips
Import and export method: Load port , Ring Frame
Size: L2770 * W1460 * H1900mm
