SIC wafer defect detection equipment
advantages introduction
The testing and verification data of SIC defect detection equipment has been recognized by domestic and foreign customers
Adopting high-speed and high-performance linear cameras, supporting multiple magnification switching
Using bright field, dark field, PL, and DIC visual technology to detect various defects
Detection accuracy of 10um
Parameter configuration
Equipped with high-definition camera to achieve automatic guidance and positioning of wafer positionAutomatic scanning measurement of chamfer roughness using a high-precision laser microscope and 20X/50X objective lens
Paired with dual or multiple port EFEM units to dock with OHT&AMR for fully automatic loading and unloading
Function Description
Applicable products: Semiconductor 6/8-inch SIC wafersApplicable process segments: chamfering/surface grinding/surface polishing/cleaning/final inspection, etc
Function Description:
1. The EFEM unit supports manual or OHT feeding of FOSB/FOUP/OC and other materials
2. Edge of wafer+front and back sides
3. Independently developed defect detection algorithm that automatically detects, analyzes, and classifies defects
4. Defect types include Downfall, Triangle, Carrot, Micropipe, IGSF, Bar SF, SF, BPD, Particle, Pit, Scratch, etc
