Wafer hidden crack detection equipment
advantages introduction
Self developed defect detection algorithm combined with deep learning for automatic defect classification
Using infrared technology for internal inspection of wafer, the minimum detectable hidden crack defect is 0.4mm
Effectively control the flow of internal hidden crack defects in the subsequent process
High speed detection of natural or man-made hidden cracks
Hardware and software are equipped with standard interfaces that comply with SEMI standards for fast and reliable integration
Parameter configuration
Equipped with self-developed infrared illumination system and high-speed linear shortwave infrared camera to achieve detection of hidden cracks and defects inside wafersCapable of detecting and classifying, comprehensively adjusting thresholds and crack characteristics, and flexibly optimizing detection results
Paired with 4-port or multi port EFEM units to dock with OHT&AMR for fully automatic loading and unloading
Function Description
Applicable products: 6/8/12 inch wafers for semiconductorsApplicable process segment: post cutting process/pre polishing process
Function Description:
1. The EFEM unit supports manual or OHT, AGV automatic loading of FOSB/FOUP/OC and other materials
2. Defect types include: detecting cracks (hidden cracks) inside the wafer that cannot be observed by the human eye
