Pattern wafer defect detection equipment

advantages introduction

2x/5x/10x/20x/50x multi magnification objective lens automatic switching
Black and white/color dual light path design
Bright/dark field detection mode
High precision autofocus, compatible with different height differences
Detection accuracy 0.1um

Parameter configuration

Equipped with two high-definition cameras, black and white/color
Using high-speed aerial photography technology and high-precision mobile platform to achieve rapid defect detection
Automatic Re inspection (ADR)+Automatic Defect Classification (ADC)
Paired with dual or multiple port EFEM units to dock with OHT&AMR for fully automatic loading and unloading

Function Description

Applicable products: Semiconductor 8/12 inch patterned wafer
Applicable process segments: Thin film deposition, photoresist, laser slotting, wafer cutting, etc
Function Description:
1. The EFEM unit supports manual or OHT automatic feeding such as FOSB/FOUP/OC
2. High speed aerial photography with black and white camera
3. Automatic re inspection of color cameras and automatic classification of defects4. Defect types: Scratch, Crack, Particle, color difference, scratch deviation, metal residue, metal missing, dirt, Die loss , detachment, etc