Wafer Box Packaging Equipment

advantages introduction

The first generation device has been recognized by the client and is currently developing a second-generation upgraded version of the device
Control the cleanliness level of equipment to ISO Class1
The UPH of the second-generation upgraded device has been increased to 24 boxes/H
The second-generation upgraded version of the device supports bag insertion in multiple directions
Standardization of research and development, combination of multiple modules, support for customized development

Parameter configuration

Equipped with independently developed bag opening and sealing module to achieve fast heat sealing packaging
Independently developed traffic control system
Equipped with self-developed optical architecture for sealing inspection
Integrating multiple port loading and unloading units with OHT&AMR to achieve fully automatic loading and unloading
Equipped with multi axis module to achieve full coverage of label attachment development

Function Description

Applicable products: Semiconductor 12-inch wafer FOSB
Applicable process segments: Packaging 
Function Description:
1.Support FOSB/FOUP manual or OHT automatic feeding
2. Equipped with RFID read-write function
3. Support FOSB accessory inspection and disassembly function
4. Support FOSB desiccant pasting, labeling, and label checking functions
5. Support FOSB automatic upper and lower packaging bags, PE/AL bag heat sealing packaging function