Wafer character measurement equipment

advantages introduction

The first generation of SI wafer character measurement has been recognized by domestic customers, and the second generation of SIC wafer character measurement is currently under development
The first domestic device to achieve online measurement of wafer characters
Using the confocal principle of laser microscope and self-developed algorithm to achieve high-precision measurement
Equipment measurement repeatability accuracy<1um

Parameter configuration

Equipped with independent optical path design and high-definition camera to achieve automatic wafer guidance and positioning
Using high-precision laser microscope and 20X/50X objective lens for automatic scanning and measurement of characters
Equipped with independent optical path design and high-definition camera to achieve measurement of wafer film edge distance
Paired with dual or multiple port EFEM units to dock with OHT&AMR for fully automatic loading and unloading

Function Description

Applicable products: 6/8/12 inch semiconductor Si wafers, SIC wafer
Applicable process segments: Surface grinding/polishing/cleaning/final inspection, etc
Function Description:
1. The EFEM unit supports manual or OHT automatic feeding such as FOSB/FOUP/OC
2. HD camera automatically guides positioning
3. High precision laser microscope automatic measurement
4. High definition camera for measuring wafer film edge distance