Silicon wafer edge/back surface detection equipment: AXM-1200HT

advantages introduction

Mass production defect detection equipment recognized by international and domestic clients

With a detection accuracy of 0.2 μ m, the production capacity is higher and the throughput reaches 80WPH
Pit detection unit automatic defect review (ADR) and automatic defect classification (ADC)
Combining self-developed defect detection algorithm with deep learning, automatic defect detection (AOI) and automatic defect classification (ADC)
Standardized detection unit, multi module combination, supporting customized combination
Self developed wafer edge clamping and positioning detection to reduce secondary pollution and damage to the wafer

Parameter configuration

Equipped with a patented laser detector and 5 high-speed linear cameras to achieve edge detection of wafers
Equipped with self-developed optical architecture and optical system to achieve front and back defect detection
Equipped with self-developed optical architecture to achieve precise detection of Pit defects
Paired with dual or multi port EFEM units to connect OHT&AMR for fully automatic loading and unloading

Function Description

Applicable products: 8/12 inch wafers for semiconductors
Applicable process segments: chamfering/surface grinding/surface polishing/cleaning/drying/PW final inspection/Epi, SOI, etc
Function Description:
1. The EFEM unit supports manual or OHT loading such as FOSB/FOUP/OC
2. Edge+front and back+Pit defect detection of wafers
3. Independently developed defect detection algorithms that automatically detect, analyze, and classify defects
4. Defect types include: Scratch, Particle, Cloud, Grind Mark(SG), Dirty, Haze, Pin mark, Halo, Crack, Chip, Pit, etc