晶圆平坦度设备

优点介绍

测量数据和数据分析结果已经得到客户端认可
研发在线型和离线型量测设备
采用光干涉原理以及自研算法实现高精度量测
支持多种路径或自定义选点量测功能
量测重复精度<0.1um
The measurement data and data analysis results have been recognized by the client
Develop online and offline measuring equipment
Using the principle of optical interference and self-developed algorithms to achieve high-precision measurement
Support multiple paths or custom point selection measurement functions
Measurement repeatability accuracy<0.1um

参数配置

搭载自研校准单元实现晶圆自动引导定位
采用高精度运动平台保证快速稳定运动，快速定位
搭载光干涉检测模块实现快速量测
搭配双port或多port EFEM单元对接OHT&AMR实现全自动上下料
Equipped with self-developed calibration unit to achieve automatic wafer guidance and positioning
Adopting a high-precision motion platform to ensure fast and stable movement, as well as quick positioning
Equipped with an optical interference detection module for rapid measurement
Paired with dual or multiple port EFEM units to dock with OHT&AMR for fully automatic loading and unloading

功能描述

适用产品：半导体用6/8/12寸硅晶圆
适用工艺段：线切/表面研磨 / 表面抛光 / 清洗 / 终检等
功能说明：
1.EFEM单元支持FOSB/FOUP/OC人工或AGV自动上料
2.校准单元自动引导定位
3.高精度检测模块自动量测
Applicable products: 6/8/12 inch silicon wafers for semiconductors
Applicable process segments: wire cutting/surface grinding/surface polishing/cleaning/final inspection, etc
Function Description:
1. EFEM unit supports FOSB/FOUP/OC manual or AGV automatic feeding
2. Calibration unit automatically guides positioning
3. High precision detection module for automatic measurement