晶圆超精密激光开槽设备：LWS3000
优点介绍
利用高频率皮秒激光，开槽时降低开槽热影响和热堆积
采用气浮平台实现高速精密微加工
光束整形减少能量损失
窄、宽光束可自动交换
实现高品质加工
通过三个光束同时加工的方法提高生产效率
Utilizing high-frequency picosecond lasers to reduce thermal effects and thermal accumulation during grooving
Implementing high-speed and precision micro machining using an air flotation platform
Beam shaping reduces energy loss
Narrow and wide beam can be automatically switched
Realize high-quality processing
Improving productivity through three spot processing methods
参数配置
功能描述
适用产品：半导体用8英寸、12英寸晶圆主要功能：用皮秒激光去除钝化层、TEG、金属布线和Low-K材料
进出料方式：Ring Frame
尺寸：L2200 * W2000 * H1850mm
Applicable products: 8-inch and 12 inch wafers for semiconductors
Main function : Use picosecond laser to remove passivation layer, TEG, metal wiring, and Low-K materials
Import and export method: Ring Frame
Size: L2200 * W2000 * H1850mm
