LED隐切设备：SLS602
优点介绍
两束/道激光加工，配有光束间隙自动调节功能，可最大程度提高WPH
破碎晶圆可全自动加工，包括边缘检测/视觉定位/自动隐切
配有高度传感器，测量/补偿晶圆片平整度，达到3um精度
在单个料盒设置不同的配方
在CH1/CH2 可设置不同的切割参数
Two beams/pass processing equipped with beam gap auto adjustment to maximize WPH
Fully automatic broken wafer processing include edge detection / vision align / auto dicing.
Equipped with height sensor to measure/compensate wafer flatness to achieve 3um accuracy.
Different recipe setting in single cassettes
Different dicing parameter for CH1/CH2
参数配置
功能描述
主要功能：通过在蓝宝石晶圆片内部聚集激光来实现对晶圆层的加工,不会对晶圆的表面产生任何影响进出料方式：Ring Frame
设备尺寸：L1560 * W1600 * H1800mm
Applicable products: 4-inch, 6-inch, LED sapphire wafer / SiC wafer
Main function: to achieve modified layer in the sapphire wafer by focusing a laser inside the wafer，not affect the surface of the wafer
Import and export method: Ring Frame
Size: L1560 * W1600 * H1800mm
