半导体

线切自动化设备

优点介绍

国内首台线切AGV自动化设备,成功实现对晶棒多线切设备自动上下料
正在开展II期自动化研发
支持大负载高精度,自动纠偏上下料&物料搬运
AGV自动化设备支持XYZ , Rx ,Ry ,Rz 方向的调整
研发标准化,多模块进行组合,支持定制化开发
全自动化搬运,智能化物料管控,智能调度
The first domestic line cutting AGV automation equipment has successfully achieved automatic loading and unloading of multi line cutting equipment for crystal bars
We are currently conducting Phase II automation research and development
Support high precision for large loads, automatic correction of loading and unloading, and material handling
AGV automation equipment supports adjustment in XYZ, Rx, Ry, Rz directions
Standardization of research and development, combination of multiple modules, support for customized development
Fully automated handling, intelligent material control, and intelligent scheduling

参数配置

搭载自主研发线切AGV自动化设备
搭载定制化转运AGV
智能固化库存储
智能物料管控系统&智能物流系统
搭配多port上下料单元对接AGV实现全自动上下料
Equipped with independently developed line cutting AGV automation equipment
Equipped with customized transport AGV
Intelligent solidification library storage
Intelligent Material Control System&Intelligent Logistics System
Matching multiple port loading and unloading units with AGV to achieve fully automatic loading and unloading

功能描述

适用产品:半导体用12寸晶圆棒
适用工艺段: 灰区段
功能说明:
1.支持晶圆棒自动量测功能
2.支持晶圆棒粘棒设备自动上下料
3.支持晶圆棒多线切设备自动上下料
4.支持线切后转运&清洗机自动上下料
5.支持水箱,料座,裸晶棒,粘棒后物料等物料的管控存储
Applicable products: 12 inch wafer bars for semiconductors
Applicable process section: Grey section
Function Description:
1. Support automatic measurement function for wafer bars
2. Support automatic loading and unloading of wafer stick sticking equipment
3. Support automatic loading and unloading of wafer rod multi line cutting equipment
4. Support automatic loading and unloading of wire cutting, transfer, and cleaning machines
5. Support the controlled storage of materials such as water tanks, material holders, bare crystal rods, and post stick materials