晶圆盒包装设备

优点介绍

第一代设备已经得到客户端的认可，正在研发第二代升级版设备
设备洁净等级管控至ISO Class1
第二代升级版设备UPH提升至24盒/H
第二代升级版设备支持多个方向入袋
研发标准化，多模块进行组合，支持定制化开发
The first generation device has been recognized by the client and is currently developing a second-generation upgraded version of the device
Control the cleanliness level of equipment to ISO Class1
The UPH of the second-generation upgraded device has been increased to 24 boxes/H
The second-generation upgraded version of the device supports bag insertion in multiple directions
Standardization of research and development, combination of multiple modules, support for customized development

参数配置

搭载自主研发开袋封口模块实现快速热封包装
自主研发流量管控系统
搭载自研光学架构进行封口检查
搭配多port上下料单元对接OHT&AMR实现全自动上下料
搭载多轴模组实现标签贴附全覆盖
Equipped with independently developed bag opening and sealing module to achieve fast heat sealing packaging
Independently developed traffic control system
Equipped with self-developed optical architecture for sealing inspection
Integrating multiple port loading and unloading units with OHT&AMR to achieve fully automatic loading and unloading
Equipped with multi axis module to achieve full coverage of label attachment development

功能描述

适用产品：半导体用12寸晶圆盒
适用工艺段： 出货包装段
功能说明：
1.支持FOSB/FOUP人工或OHT自动上料
2.具备RFID读写功能
3.支持FOSB配件检查和拆解功能
4.支持FOSB贴干燥剂，贴标签，标签检查功能
5.支持FOSB自动上下包装袋，PE/AL袋热封包装功能
Applicable products: Semiconductor 12-inch wafer FOSB
Applicable process segments: Packaging 
Function Description:
1.Support FOSB/FOUP manual or OHT automatic feeding
2. Equipped with RFID read-write function
3. Support FOSB accessory inspection and disassembly function
4. Support FOSB desiccant pasting, labeling, and label checking functions
5. Support FOSB automatic upper and lower packaging bags, PE/AL bag heat sealing packaging function