玻璃晶圆激光打孔设备：SFD3000
优点介绍
配备激光功率自动补偿功能
可用于玻璃晶圆打孔和玻璃切割
配备Bessel光学计（轴棱镜）,沿光束进行方向跟随长焦深（DOF）实现恒定峰值功率，范围通常为0.5~2.0mm
具有振镜自动校正功能和自动偏移补偿功能
一般光斑大小是2~3um
Equipped with laser power automatic compensation function
Can be used for glass wafer drilling and glass cutting
Equipped with Bessel optics(axicon) for constant peak power along an increased depth of focus(DOF) region, ranging typically from 0.5~2.0mm
Equipped with automatic scanner calibration and automatic offset compensation
General spot size is about 2~3um
参数配置
功能描述
适用产品：8英寸、12英寸玻璃晶圆主要功能：实现在玻璃激光打孔/切割
进出料方式：FOUP 到 FOUP
设备尺寸：L1500 * W2000 * H1800mm
Applicable products: 8-inch, 12 inch glass wafers
Main function: To achieve laser drilling / cutting on glass wafer
Import and export method: FOUP to FOUP
Size:L1500 * W2000 * H1800mm
